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die attach package void analysis in French

Instead of “Analyze des vides”, I would say “Analyse des inclusions gazeuses”.

For “die attach package”, according to the context, I propose the following translations:

For a single chip in the wafer: “du circuit intégré”,
For the whole wafer: “de la matrice de circuits intégrés” (you may also use the anglicism “wafer”)
for the package: “de la puce electronique”.

Depending whether “voids” are located in the material or at the surface, you can replace the preposisitions “du/de”(of) by “dans”(in) or “sur”(on)